0,8 mm tabula ad tabulam iungo duplici ordine tabulam ad tabulam connector
Technical Information
Pix: 0.8mm No
Paxillus: 30~ 140pin
PCB modus glutino: SMT
Docking direction: CLXXX gradu verticali docking
Electroplating method: aurum/stannum vel goldflash
PCB Docking altitudo: 5mm ~ 20mm (XVI species altitudinis)
Impedimentum differentialis range: 80~ 110Ω 50ps(10~90%)
Damnum insertio: ＜1.5dB 6GHz/12Gbps
Redi damnum: 10dB 6GHz/12Gbps
Crosstalk: ≤ -26 dB 50ps(10~90%)
Specifications
| Diuturnitatem | 100mating cycles |
| Coitus coitu | 150gf max./ par Contact |
| Unmating vis | 10gf min./ par Contact |
| Operating Temperature | -40℃~105 |
| Calor vitae | 105±2℃ 250 horae |
| Constans temperatus | |
| et humiditatem | Relativum humiditas XC ~ XCV% XCVI horis |
| Nulla resistentia | 100 MΩ |
| Ratedcurrent | 0.5~1.5A/per pin |
| Contactus resistentia | 50mΩ |
| Rated voltage | 50V~100V AC/DC |
Conceptus
| Pix | 0.80 mm |
| No. de Pins | 30, 40, 50, 60, 80, 100, 120, 140 |
| Terminatio technology | SMT |
| Connectors | Male connector，Verticalis Male connector，Vertical |
| Speciales versiones | Verticalis docking altitudinem 5~ 20mm consequi potest, et varietates positis altitudines eligi potest |
Valde fidelis Terminal Design
Punctum contactus attenuatum consequi potest magnam vim positivam ad certas contactum singulares structuras terminales destinatas ad altam frequentiam transmissionis destinatam
Inserta Face Chamfer
Apicibus signatis contactum spondemus lenis, tutam abstergendam actionem in iungo coitu
Distantia friction
Maior distantia absterget (1.40mm), contactum fidem et compensans tolerantias inter diversas altitudines
Plene Lorem Conventus et Reflow Soldering
Pro efficiens processus in hodierna ecclesia lineae
Features
Habitationem et terminales profile spondent sustentationem usque ad 12Gb/s Compatible cum Plu Gen 2/3 et SAS 3.0 altum celeritate perficiendi in lectus acervus altitudines
Differentialis Lmpedance
Insertiones Damnum
Redi damnum
Circa finem Crosstalk (NEXT)
